San Francisco Circuits showcases ENEPIG, a cutting-edge surface finish for Printed Circuit Boards (PCBs) that is revolutionizing electronic interconnection methods. This metallic coating offers remarkable reliability, effectively tackling intricate manufacturing hurdles while ensuring exceptional protection for critical electronic assemblies.
ENEPIG surface finish.
ENEPIG has become a leading choice for PCB surface finishes, recognized for its competitive palladium pricing and substantial technological advantages over other methods. This advanced coating consists of a complex multilayer metal arrangement—copper base, nickel layer, palladium transition, and a gold top layer—offering excellent corrosion resistance and effectively addressing the “dark pad” issue.
Perfect for High-Performance Needs
ENEPIG is versatile enough to support various mounting technologies, excelling in multiple package types such as ball grid arrays, surface-mount devices, wire bond connections, and press-fit applications. Its ultra-thin gold layer (ranging from 0.05μm to 0.1μm) streamlines manufacturing processes while enhancing durability and prolonging operational life.
Key Features of ENEPIG
- prevents Metallurgical Bonding Issues
- Exhibits Exceptional Structural Strength
- offers Cost-Effective Manufacturing Solutions
- Complies with Strict Environmental Standards
- Delivers Superior Interconnection Performance
Use Cases
ENEPIG is the go-to solution for complex multilayer PCBs, high-density assemblies, and critical applications in sectors such as defense, healthcare, aerospace, and advanced technology manufacturing.
Discover more on the San Francisco Circuits website.
