Exploring the Advantages of Hard and Soft Gold Surface Finishes in PCB Manufacturing
Choosing the right surface finish is essential for maximizing the performance of printed circuit boards (PCBs). Gold is often regarded as a premier option due to its exceptional electrical conductivity, resistance to oxidation, superior solderability, long shelf life, and its role as an effective etch resist.
San Francisco Circuits provides a variety of contemporary, lead-free surface finishes that adhere to RoHS and WEEE regulations.
The Electrolytic Nickel/Gold (Ni/Au) finish entails applying a layer of gold plating over nickel, with a low-stress nickel layer positioned between the copper substrate and the gold overlay.
The purity of gold varies, with hard gold typically around 99.6% pure and soft gold reaching 99.9% purity.The thickness of the gold layer is a vital consideration that changes based on the specific application.
Hard gold is an alloy that combines gold with elements like cobalt, nickel, or iron. This finish is ideal for applications that experience frequent use and significant wear, such as:
- Interconnected Carrier Boards
- Edge Connector fingers
- Keypads
- Contacts
Conversely, soft gold finishes are predominantly utilized on boards intended for applications that require wire bonding, high solderability, and weldability.
For further insights into hard and soft gold finishes, as well as other PCB surface options, visit the San Francisco Circuits website >>
