LCR Embedded Systems, a leader in integrated systems, chassis, and backplanes, has published a new article titled “Thermal Management Challenges in SOSA Systems.” this piece highlights the difficulties customary cooling methods face in maintaining reliable operation within critical C5ISR applications.
The article delves into how the surge in data transmission rates and processing capabilities, driven by advanced sensors and computing technologies in defense applications, is straining the thermal capacities of 3U VPX and SOSA-compliant systems.
According to LCR Embedded systems, the heat generated within VPX systems has significantly increased since their inception. this rise is especially evident in high-speed FPGA and CPU 3U modules, which are essential for elegant RF, EW, and SIGINT applications, reaching nearly 200W TDP (total dissipated power) at peak performance due to elevated data rates.
These developments have introduced significant challenges in thermal management. The full article elaborates on internal cooling strategies for SOSA systems,addressing the following key areas:
- Design Considerations
- Module Design
- Chassis Design
- Mixed Module Support – 48.2, 48.4, 48.8
- Innovative Chassis Design Solutions
LCR Embedded Systems is tackling the internal cooling challenges in VPX and SOSA systems by investigating chassis design considerations, as the demand for high-power 3U VPX modules continues to grow.
For more insights, read the complete article or visit LCR Embedded Systems’ website.
