Windform® LX 3.0 is a glass-fiber-reinforced polyamide composite developed by CRP Technology for Selective Laser Sintering (SLS). This material provides excellent mechanical properties, including a tensile strength of 60.42 MPa and a tensile modulus of 6048 MPa. Its electrical insulation capabilities are notable, with a Comparative Tracking Index (CTI) of 600, making it suitable for electronic components. Additionally, Windform® LX 3.0 exhibits high thermal resistance, with a Heat Deflection Temperature (HDT) of 175.9°C, ensuring performance stability under thermal stress. The material also offers an excellent surface finish in its sintered state, with a roughness average (Ra) of 3.2 μm after manual finishing.