Introducing windform® GF 2.0, a cutting-edge composite material crafted by CRP Technology specifically for Selective Laser Sintering (SLS) applications. This innovative material is enhanced with aluminum and glass fibers, substantially boosting its thermal and mechanical characteristics compared to its earlier version, Windform® GF.With its striking light gray hue and metallic luster, Windform® GF 2.0 is ideal for a variety of functional and aesthetic uses in unmanned aerial vehicles (UAVs).
Rugged Embedded Computing, Single Board Computers, Processing Modules & Embedded Devices
