Introducing the XPedite2770 by Extreme Engineering Solutions (X-ES): a state-of-the-art 3U VPX FPGA module tailored for advanced signal processing, data protection, and intricate computational tasks.
Utilizing the AMD (previously Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP), the XPedite2770 offers remarkable adaptability and reconfigurability.Its conduction-cooled architecture guarantees dependable performance in demanding conditions, making it ideal for sectors such as defense, aerospace, and telecommunications.
XPedite2770
This module boasts a heterogeneous computing framework, featuring dual ARM® Cortex®-A72 processor cores, dual ARM® Cortex®-R5F real-time processor cores, an expansive FPGA fabric, and an efficient Network-on-Chip (NoC) interconnect.
These components empower high-performance computing for rigorous applications, including signal processing, packet management, sensor I/O, DSP-heavy tasks, 5G wireless infrastructure, cloud computing, and sophisticated aerospace and defense systems.
Rapid Connectivity & Storage Solutions
The XPedite2770 is designed with high-speed interfaces to accommodate bandwidth-heavy operations. It includes two x4 PCI Express interfaces, essential for swift data transfers in real-time applications. Moreover, the module is equipped with two 10/100/1000BASE-T Ethernet ports, facilitating smooth network integration and communication with othre devices.
With a capacity of up to 256 GB of onboard NAND flash storage, the module also features various I/O ports, such as LVDS, single-ended GPIO, and RS-232/422/485 serial connectivity via backplane connectors.
Enhanced Expansion with XMC Site
The XPedite2770 offers additional expansion capabilities through its integrated XMC site, enhancing versatility in system configurations. this site includes a x8 PCI Express Gen2-capable interface, which can support PCIe Gen3 based on user requirements.
Moreover, the XMC site is outfitted with X12d I/O directly mapped to the VPX backplane connectors, ensuring compatibility with various system backplanes.
Block Diagram
FPGA & Processing Capabilities
The XPedite2770 is engineered for high-performance logic and DSP applications, making it an excellent choice for compute-intensive tasks. At its core lies the AMD Versal® Prime VM1402 ACAP, a robust and versatile processing platform. It features a dual-core ARM® Cortex®-A72 processor, equipped with 48 KB/32 KB L1 cache with parity and ECC, alongside a 1 MB L2 cache with ECC.
Additionally, the module incorporates a dual-core ARM® Cortex®-R5F processor, which includes a 32 KB/32 KB L1 cache and a 256 KB TCM with ECC. These processing units collaborate to deliver a powerful and scalable computing solution capable of efficiently managing complex workloads.
Memory & Storage Solutions
To cater to data-intensive applications,the XPedite2770 is outfitted with high-speed memory and storage options. It features 16 GB of LPDDR4 ECC SDRAM in a dual-channel configuration, ensuring optimal memory bandwidth for demanding tasks. The module also supports up to 256 GB of NAND flash storage, providing ample capacity for data storage and logging needs. Additionally,it includes 4 Gbit of QSPI FPGA configuration flash,enabling rapid FPGA configuration and reprogramming.
Complete I/O Support
The XPedite2770 provides extensive I/O support, ensuring seamless integration with diverse system architectures.
VPX (VITA 46) P0 I/O
The module features two IPMB connections to an IPMI controller, facilitating remote monitoring and management of system health and performance.
VPX (VITA 46) P1 I/O
For high-speed connectivity, the XPedite2770 includes two 10GBASE-R Ethernet ports, delivering rapid data transfer rates for network-intensive applications. It also features a x4 PCI Express Gen3-capable interface to P1.A, along with a x4 PCI Express Gen2-capable interface to P1.B, which can support PCIe Gen3 based on user applications.Additionally, the module supports XMC P16 I/O, mapping P1w9-X12d per VITA 46.9, allowing for flexible system configurations.
VPX (VITA 46) P2 I/O
The module offers further connectivity options with two 10/100/1000BASE-T Ethernet ports,ensuring reliable network communication. It also includes six LVDS GPIO, enabling high-speed data transmission for various applications. Furthermore, the module features a x1 High-Speed Serial (HSS) interface, which can support PCIe Gen3 or SATA, depending on user requirements.
Additionally, the XPedite2770 includes one RS-232/422/485 serial port, ensuring compatibility with a wide array of legacy and modern communication protocols. A build option is available for eight LVDS and 16 SE GPIO from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d, allowing for further customization to meet specific submission needs.
SOSA Compliance & Physical Attributes
The XPedite2770 is crafted to meet contemporary defense and aerospace standards, ensuring smooth integration into existing system architectures.It features a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U-14.2.16, providing interoperability with a broad range of VPX systems. Additionally, the module adheres to the SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N), ensuring compliance with industry benchmarks.
The XPedite2770 is available in a 3U VPX-REDI conduction- or air-cooled form factor, making it suitable for deployment in harsh environments. Its dimensions are 100 mm x 160 mm, with a 0.8-inch pitch without a solder-side cover, and options for 0.85-inch and 1.0-inch pitch with a solder-side cover and Two-Level Maintenance (2LM) support. These physical characteristics render the XPedite2770 a robust and adaptable solution for demanding military and aerospace applications.
Efficient Development with X-ES HMDK
To accelerate development and deployment,X-ES offers the Hardware Manager Development Kit (HMDK),a comprehensive suite of tools and resources. The HMDK includes Linux Yocto support, ensuring compatibility with embedded software environments. It also provides a pre-validated environment featuring a library of optimized IP, software components, and design resources.
The Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, FPGA development Kit (FDK), and example designs tailored for the XPedite2770 further streamline development efforts. By providing a robust development ecosystem, X-ES empowers engineers to swiftly design, test, and deploy customized solutions leveraging the powerful capabilities of the XPedite2770.
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