San Francisco Circuits (SFC), a leader in the fabrication, assembly, and testing of printed circuit boards (PCBs) for unmanned systems and robotic technologies, has published an insightful article highlighting recent advancements in microelectronics.As PCB packages continue to shrink and innovative electronic designs require more compact circuit boards, the precision of microelectronics becomes increasingly critical. Adhering to best practices in microelectronics during PCB production—including design,layout,fabrication,and assembly—ensures optimal device performance,even in smaller form factors.
Explore the complete article on the San Francisco Circuits website.
This article delves into:
- Elements of conventional designs, including plated through-hole (PTH) components and surface mount technology (SMT)
- Ball grid array (BGA) packages and the use of microvias
- Through-hole technology connectors, such as USB-C
- High-density interconnects (HDI) and the design strategies necessary for achieving narrow linewidths
- Common applications of microvias in eight-layer PCBs
For further insights into contemporary microelectronics and strategies for future-proofing PCB designs to adapt to evolving trends in size and density, visit SFC’s website to read the full article.
