San Francisco Circuits has published a comprehensive article discussing Via Tenting, a technique that involves applying a soldermask layer to cover the via holes on a Printed Circuit Board (PCB).
during the assembly and operation of PCBs, copper components can be vulnerable to damage. The soldermask layer utilized in via tenting serves to protect these traces, enhancing their durability and reducing the risk of electrical shorts.
Additionally,tented vias can effectively prevent solder from entering an untented via hole,which could lead to shorts on the opposite side of the PCB. Despite its advantages, via tenting can introduce specific challenges. The sealed vias may trap chemicals,creating pockets that can eventually seep into the PCB material.
Although there are strategies to mitigate these chemical concerns, they remain significant considerations for both designers and assemblers.
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For further inquiries regarding PCB fabrication and assembly, reach out to the experts at San Francisco Circuits by calling 800-SFC-5143 or emailing sales@sfcircuits.com to discuss your upcoming project.
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