Windform® FX BLACK is an innovative composite material crafted by CRP Technology, specifically designed for Selective Laser Sintering (SLS) applications.This polyamide-based substance mimics the properties of polypropylene and ABS molded components, offering remarkable adaptability and robust strength. its ability to withstand repeated bending and twisting, coupled with its impact resistance even in colder conditions, makes it an excellent choice for unmanned aerial vehicle (UAV) parts that demand both resilience and adaptability.
Rugged Embedded Computing, Single Board Computers, Processing Modules & Embedded Devices
