Introducing Windform® LX 3.0, a cutting-edge composite material reinforced with glass fibers, engineered by CRP technology specifically for Selective Laser Sintering (SLS) applications. This innovative material boasts impressive mechanical characteristics, featuring a tensile strength of 60.42 MPa and a tensile modulus of 6048 MPa. Its exceptional electrical insulation properties are highlighted by a Comparative Tracking Index (CTI) of 600, making it an ideal choice for various electronic components. Furthermore,Windform® LX 3.0 demonstrates remarkable thermal stability, with a Heat Deflection Temperature (HDT) reaching 175.9°C, ensuring reliable performance even under elevated temperatures. The material also achieves a superior surface finish in its sintered form, with an average roughness (Ra) of just 3.2 μm following manual finishing processes.
Rugged Embedded Computing, Single Board Computers, Processing Modules & Embedded Devices
