Introducing the RMC3-160: A Robust 19″ Rackmount Solution
The RMC3-160 is a durable 19-inch rackmount chassis specifically engineered to accommodate 3U VPX and SOSA-compliant payloads. Featuring 16 conduction-cooled slots tailored for VITA 48.2 modules, this chassis offers options for either 40Gb or 100Gb backplanes, making it an excellent choice for rigorous UAV and unmanned systems applications.
Enhanced Design Features
This 4U low-profile chassis boasts a hinged front panel that facilitates easy access to modules while providing superior EMI shielding. Additionally, the rear I/O panel can be customized and includes a variety of connectors such as SMA, DB, RJ45, and 38999, ensuring versatile connectivity options.
Technical Specifications
| Dimensions (H x W x D) | 6.96 x 19 x 22 inches 177 x 482.6 x 559 mm (excluding handles & connectors) |
| Power Requirements | Input: 115VAC 60/400Hz, 28VDC, or 270VDC Capable of delivering up to 1500W output power |
| Input/Output Capabilities | Custom I/O panel designed for high-speed connectivity High-density MIL-STD 38999 circular connectors 10GbE 38999 Hercules connectors for rapid data transfer Rugged SMA connectors for RF and optical I/O |
