Engineered to endure severe environmental challenges, the conduction-cooled XPedite2770 module combines cutting-edge processing capabilities, dependable memory systems, and robust ruggedization to guarantee operational reliability in demanding scenarios.

Tailored for Extreme and Challenging Conditions

Constructed to ruggedization Level 5,the XPedite2770 ensures remarkable durability in the harshest environments. It adheres to stringent military specifications for shock (40g, 11 ms sawtooth), vibration (0.1 g²/Hz, 5 to 2000 Hz), and humidity (up to 95% non-condensing), making it perfectly suited for unmanned aerial, ground, and maritime applications in extreme settings.

Its conduction-cooled architecture effectively manages heat dissipation, enabling the module to function reliably within a broad temperature range of -40°C to +85°C, while it can withstand storage temperatures from -55°C to +105°C. this capability ensures consistent processing performance in both frigid and arid climates.

Advanced Memory and Secure Data Storage

The XPedite2770 features a dual-channel memory system that includes:

• 16 GB of LPDDR4 ECC SDRAM for enhanced bandwidth processing
• Up to 256 GB of NAND flash for persistent data storage
• 4 Gbit of QSPI FPGA configuration flash, providing secure boot and programmable logic functionalities

Ideal for Unmanned and Autonomous Systems

Optimized for SWaP-constrained unmanned platforms, the XPedite2770 presents a low-power, high-efficiency computing solution for various applications, including:

• Control of autonomous vehicles and sensor integration
• Mission-critical computing and real-time data analysis
• Electronic warfare and secure communication systems

With its rugged design, extensive environmental resilience, and high-performance memory, the XPedite2770 stands out as an excellent choice for integrators seeking military-grade embedded computing solutions for unmanned systems and next-generation defense technologies.