Introducing X-ES’s Advanced Embedded Solutions with Intel’s Latest Processors

Extreme Engineering Solutions (X-ES) has unveiled an innovative lineup of rugged embedded products powered by Intel’s newly launched Xeon D-1700 and D-2700 series processors. Previously known as Ice Lake-D, these processors are designed as energy-efficient System-on-Chip (soc) solutions, featuring integrated 40 Gigabit Ethernet for enhanced connectivity. The Ice Lake-D technology significantly outperforms its predecessors in processing capabilities and memory density, making it especially suitable for demanding applications in unmanned aerial vehicles (UAVs) and robotics.

Robust Performance in Challenging environments

Engineered to operate in extreme conditions, the new processors support a temperature range from -40°C to 85°C and utilize high-density BGA packages. They come in High Core Count (HCC) and Low Core Count (LCC) variants, allowing X-ES to create a diverse array of products tailored to various customer requirements:

• The Xeon D-2700 series (HCC) offers up to 20 cores, delivering extraordinary processing power with four memory channels for high-performance computing.
• The Xeon D-1700 series (LCC) provides an efficient computing solution with up to 10 cores and three memory channels, all within a power-saving design.

Comprehensive Solutions on a Single Board

Both product lines from X-ES feature a state-of-the-art processor housed in a solderable BGA package, complemented by a security FPGA and extensive I/O connectivity, all integrated onto a single board.X-ES is actively developing products across various industry-standard form factors, with opportunities for further customization and enhancement.

Enhanced Security Features

Incorporating SecureCOTS technology alongside a Microsemi PolarFire FPGA, X-ES products are designed to host custom functions that safeguard data integrity and confidentiality, making them ideal for applications requiring stringent security measures.

Maximized Memory and Storage Solutions

Leveraging the increased memory channel support of the Xeon D-1700 and D-2700 series, X-ES integrates the highest possible memory density configurations. Additionally, for non-volatile storage, the company continues to utilize SLC NAND flash, known for its durability, reliability, and performance.

Expandable System Capabilities

X-ES provides a competitive edge with the availability of XMC sites,allowing for expanded system functionality beyond the core offerings of these new products. With highly configurable expansion options and extraordinary I/O throughput, these XMC capabilities present meaningful growth potential for integrated systems.

Long-Term Support and Compatibility

The xeon D-1700 and D-2700 series processors are backed by Intel’s Internet of Things Group (IOTG), wich has pledged 15 years of availability for this processor family, ensuring a dependable component for future solutions. Additionally, Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are readily available.

Adherence to Industry Standards

X-ES products comply with the Sensor Open Systems Architecture (SOSA) standard, an initiative led by the U.S. department of Defense aimed at enhancing component interoperability and minimizing the costs and risks associated with multi-vendor system integration.