Windform® SP is a carbon-fiber-reinforced polyamide composite developed by CRP Technology for Selective Laser Sintering (SLS). This material offers excellent mechanical properties, including high resistance to impact, vibrations, deformation, and elevated temperatures. With a tensile strength of 76.10 MPa and an elongation at break of 11.38%, Windform® SP ensures both strength and flexibility for UAV components.
Windform materials
Designed for use in high-demand sectors, Windform® SP is waterproof at pressures of 3–4 bars, making it suitable for applications exposed to moisture and liquids. Its thermal properties are notable, with a Heat Deflection Temperature (HDT) of 186.5°C and a melting point of 193.3°C, ensuring performance stability under thermal stress.