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X-ES Unveils Powerful 16-Core Intel Xeon D Single Board Computers!

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X-ES Unveils Powerful 16-Core Intel Xeon D Single Board Computers!

Extreme Engineering Solutions (X-ES), a developer of embedded computing solutions, has announced that its Intel Xeon D-1500 family

Innovative Embedded Solutions wiht Intel Xeon D Processors

Extreme Engineering Solutions (X-ES), a leader in embedded computing technology, has unveiled its latest advancements in single board computers (SBCs) powered by the Intel Xeon D-1500 series processors. These new models now feature up to 16 Xeon-class cores within a single, energy-efficient System-on-Chip (SoC) configuration, offering native extended temperature support across four, eight, and twelve core variants.

Initially limited to eight cores, the Intel Xeon D processors have evolved to accommodate configurations with 12 and 16 cores, enhancing their computational capabilities significantly.

Applications and Performance Enhancements

These high-performance, low-power processors are seamlessly integrated into X-ES VPX single board computers, making them ideal for a wide range of applications, including routers, network appliances, and military dialog systems. The built-in hardware virtualization of Intel Xeon D processors allows for dynamic service provisioning, enabling communication service providers to push the boundaries of network functions virtualization (NFV) further than ever before.

By combining X-ES’s advanced embedded SBC technology with the robust performance of high-core-count Intel Xeon D processors,users can expect enhanced networking capabilities,accelerated computing,and improved processing efficiency.

Temperature Resilience and Testing

In response to insights from the military and aerospace sectors, Intel has introduced native extended temperature support for its Xeon D processors, accommodating up to 12 cores. These processors are engineered to function effectively in extreme conditions, ranging from -40°C to 85°C. This innovation minimizes the need for separate temperature testing by X-ES engineers, thereby speeding up product availability. Additionally, X-ES conducts further testing in its in-house laboratories to ensure optimal performance under specific environmental conditions set by customers.

Advanced Thermal Management

To safeguard the processor and system from thermal failures, X-ES employs advanced Thermal Monitoring Technologies. An integrated Digital Thermal Sensor (DTS) continuously monitors the core temperature, and when necessary, the thermal management features reduce power consumption to maintain safe operating temperatures. These mechanisms not only prevent overheating but also extend the lifespan of deployed single board computers by mitigating thermal stress and component fatigue.

Rugged Design for Military and Aerospace Applications

X-ES’s embedded single board computers, equipped with Intel Xeon D processors, are meticulously designed to meet the stringent environmental and security demands of military and aerospace applications. The engineering team at X-ES enhances standard Intel Xeon D processors with Class III PCB assemblies, underfill, conformal coatings, and a hybrid heatframe design, optimizing size, weight, power, and cost (SWaP-C).

long-Term Embedded Solutions

X-ES offers a variety of Intel Xeon D processor-based SBCs, including the 3U VPX models such as XPedite7670, XPedite7672, XPedite7674, and XPedite7676, as well as the 6U VPX options like XCalibur4640 and XCalibur4643, all designed for long-term embedded solutions.

Enhanced Security Features

Several SBCs in the X-ES Intel Xeon D processor lineup incorporate SecureCOTS technology, featuring a Microsemi smartfusion 2 security SoC or Xilinx Kintex UltraScale FPGA module.These components are designed to host custom functions that protect sensitive data from unauthorized access or modification. the user-configurable modules provide a robust solution for environments requiring stringent security measures,enabling control,interception,and monitoring of the Xeon D subsystem while interfacing directly with the system through I/O connected to the VPX backplane. Additional circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork further bolster the physical security of the hardware.

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